2019 International Conference on Science in Information Technology (ICSITech) will be held on October 23-24, 2019 in Jogjakarta, Indonesia. This conference is hosted by Universiti Pembangunan Nasional “Veteran” Yogyakarta in collaboration with Universiti Teknologi Malaysia (UTM) Big Data Centre, Universitas Ahmad Dahlan, Universitas Mulawarman, Universitas Pendidikan Indonesi, Universitas Muhammadiyah Surakarta, Universiti Putra Malaysia, Universiti Malaysia Sabah, Universitas Budi Luhur, Politeknik Negeri Samarinda, Politeknik Negeri Padang, Universitas Negeri Malang, Universiti Teknikal Malaysia Melaka(UTeM), and ITSA University Columbia. The conference aims to keep abreast of the current development and innovation in the area of Science in Information Technology as well as providing an engaging platform for participants to share knowledge and expertise in related disciplines. The theme for this conference is "Embracing Industry 4.0 : Towards Innovation in Cyber Physical System".

Yogyakarta Special Region (Daerah Istimewa Yogyakarta, DIY) is officially one of Indonesia's 32 provinces. Yogyakarta is one of the foremost cultural centers of Java. This region is located at the foot of the active Merapi volcano, Yogyakarta was in the 16th and 17th centuries the seat of the mighty Javanese empire of Mataram from which present day Yogyakarta has the best inherited of traditions. The city itself has a special charm, which seldom fails to captivate the visitor. The key attraction of Yogyakarta is 'Kraton' (the Sultan's Palace). The Sultan's palace is the centre of Yogya's traditional life and despite the advance of modernity; it still emanates the spirit of refinement, which has been the hallmark of Yogya's art for centuries. This vast complex of decaying buildings was built in the 18th century, and is actually a walled city within the city with luxurious pavilions and in which the current Sultan still resides. Yogyakarta is also the only major city, which still has traditional 'Becak' (rickshaw-style) transport.

ICSITech 2019 has been approved by IEEE for Technical co-sponsorship with conference record number #46713. Short information about the conference in IEEE Conference List can be accessed here . The papers accepted and presented will be forwarding for consideration to be published in the IEEE Xplore Digital Library. Non-presented papers will be pulled from submission to IEEE Xplore. Several media type will be produced for Proceeding with the following ISBN and catalog numbers:

Media Type IEEE Catalog Number ISBN
XPLORE COMPLIANT CFP19B09-ART 978-1-7281-2380-6
USB CFP19B09-USB 978-1-7281-2379-0
PRINT CFP19B09-PRT 978-1-7281-2378-3

Selected paper at this conference will be published in the following Scopus indexed journals :

  • The paper should be written in English.
  • The length of submitted paper is at least 4 pages and no more than 6 pages in A4 paper size.
  • The paper format is as follows:
    1. The paper must conform to the standard of IEEE Manuscript Templates for Conference Proceedings. Download Template A4 DOC or LaTeX format here.
    2. References : Must be formatted using any reference management tool e.g. Mendeley, Endnote, Zotero
  • All review processes are blind peer-reviews
  • Full paper must be submitted through EDAS System ( Please make sure the link is followed by the conference code in EDAS: N25610.
  • Please contact if you have any queries

Early BirdRegular
Profesional (Regular)$ 325$ 375
Profesional (IEEE Member)$ 300$ 350
Student (Regular)$ 275$ 325
Student (IEEE Member)$ 250$ 300
Extra Paper (2nd, 3rd paper, etc)$ 200$ 250
Attendee (without paper)$ 75$ 100

Early BirdRegular
Profesional (Regular)IDR 2.500.000IDR 3.000.000
Profesional (IEEE Member)IDR 2.250.000IDR 2.750.000
Student (Regular)IDR 2.000.000IDR 2.500.000
Student (IEEE Member)IDR 1.750.000IDR 2.250.000
Extra Paper (2nd, 3rd paper, etc)IDR 1.500.000IDR 2.000.000
Attendee (without paper)IDR 1.250.000IDR 1.750.000

Important Dates

Extended Phase III

August 15, 2019

Deadline for paper submission

September 6, 2019

Notification of accepted paper

September 18, 2019

Deadline for Camera Ready Paper

October 5, 2019

Payment Deadline

October 23-24, 2019

Conference Due


Topics of interest include all aspects of computer science, computer engineering and information technology including, but not limited to :

Agent System Artificial Intelligence Big Data and Data Mining
Biomedical Informatics Cloud & Grid Computing Computer Engineering
E-Business E-Government E-Learning
Electrical & Electronic Engineering Embedded System Green Computing
Human Computer Interaction Image Processing & Computer Vision Information Security & Cryptography
Information System Mechatronics Mobile Computing & Applications
Natural Languange Processing Network & Data Communication Open Source System
Pattern Recognition Robotics Smart City
SSmart Factory Smart Product Social Networking & Application
Soft Computing Software Engineering Software Entrepreneurship
Telecommunication The Internet of Things Wireless Communication


Prof. Ir. Dwi Hendratmo W., M.Sc., Ph.D.

Institut Teknologi Bandung

Satriyo Dharmanto M.Si.

IEEE Indonesia Section

Prof. DR. Munir, M.IT.

Universitas Pendidikan Indonesia

Prof. Shi-Jinn Horng

National Taiwan University Science and Technology, Taiwan

Prof. Hjh. DR. Siti Mariyam S.

Universiti Teknologi Malaysia

Assoc. Prof. Dr. Amelia Ritahani Ismail

International Islamic University Malaysia

DR. Rafal Drezewski

AGH University of Science and Technology

Prof. Rodziah Atan

Universiti Putra Malaysia

Prof. DR. Rayner Alfred

Universiti Malaysia Sabah

Prof. DR. HeuiSeok Lim

Korea University

Prof. Goutam Chakraborty, Ph.D.

Iwate Prefectural University

Prof. DR. Didi Sukyadi

Universitas Pendidikan Indonesia

Prof. DR. Tsukasa Hirashima

Hiroshima University

Prof. DR. Burairah Hussin

Universiti Teknikal Melaka Malaysia

Prof. DR. Halimah Badioze Zaman

Universiti Kebangsaan Malaysia


Leonel Hernandez

(ITSA University, Colombia)

Mohamad Shanuddin Zakaria

Universiti Kebangsaan Malaysia, Malaysia

Hosted by

Technical co-sponsored by